Ceramic substrate is a kind of special circuit board, which has good thermal conductivity, insulation performance and high dielectric constant, and is widely used in terminal products in the field of heat dissipation. So, what is the difference between a ceramic substrate and a conventional PCB?

1. Various materials. The ceramic substrate is an inorganic material and the core is aluminum oxide or aluminum nitride; Common PCBs use FR4 fiberglass boards, which are organic materials. The ceramic substrate is brittle and cannot be laminated, while conventional printed circuit boards can be laminated in multiple layers.

2. The performance and application of ceramic substrates are different. Ceramic substrates are used in industries that require high heat dissipation, such as high power LED lighting, high power modules, high frequency communications, track power supplies, etc. Ordinary PCBs are widely used, mainly in private commercial products.

1. Various materials. The ceramic substrate is made of aluminum oxide or aluminum nitride, and the high-frequency board is mainly made of Rogers, Yalong, PTFE, etc., with low dielectric constant and fast high-frequency coupling.

2. Performance is different. Ceramic substrates are widely used in refrigeration chips and systems, power modules, automotive electronics and other fields. High frequency boards are mainly used in the fields of high frequency communication, aviation, high-end consumer electronics, etc.

3. In the field of high-frequency communication, which requires heat dissipation, a combination of a ceramic base and a high-frequency board, such as a high-frequency ceramic printed circuit board, is usually required.

The above is the difference between ceramic substrate and ordinary PCB, hope you find it useful.